Method and apparatus for creating wiring model, computer product, and method of manufacturing device

ABSTRACT

A wiring-model creating apparatus creates a three-dimensional model of a wiring pattern on a printed board based on printed-board information created by an electrical computer-aided design, as a wiring model for a mechanical computer-aided design. A three-dimensional-model creating unit creates the three-dimensional model including holes on the printed board in addition to the wiring pattern, based on the printed-board information.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a technology for creating athree-dimensional model of a wiring pattern on a printed board based onprinted-board information created by an electrical computer-aided design(CAD), as a wiring model for a mechanical CAD.

2. Description of the Related Art

Recently, electrical designing with an electrical CAD and mechanicaldesigning with a mechanical CAD has been performed in parallel indesigning of the information processing devices. The electricaldesigning includes designing of a circuit on a printed board, and themechanical designing includes designing of a shape of a housing and alayout of components.

It is possible to perform the electric designing and the mechanicaldesigning in parallel. However, a shape of a housing, for example, canput a restriction on a shape or layout of an electrical component.Therefore, information on a design with regard to the electricaldesigning and the mechanical design is repeatedly exchanged, as thedesign has progressed. To address the needs, it has been developed asystem that aids the electrical CAD and the mechanical CAD to interlockwith a capability of facilitating an exchange of information required inthe electrical designing and the mechanical designing.

For example, Japanese Patent Application Laid-Open No. H11-353341describes a three-dimensional-model creating device that createsinformation representing a three-dimensional model including wires andcomponents on the printed board, in a form that each of the wires ismodeled independently. Based on the information, an mechanical-CAD canconduct an analysis of the wiring pattern to avoid troubles such as ashort circuit expected to be happened at installation of the components,in addition to an analysis of interference between the components.Japanese Patent Application Laid-open No. 2001-202401 describes athree-dimensional-shape data-system that creates a detailedthree-dimensional model by integrating a shape of the wiring patternwith shapes of vias and lands.

However, to conduct a layout analysis of the components with themechanical-CAD, the three-dimensional model including the components andthe wiring patterns on the printed board is insufficient. To find such alayout error in which a hole is covered by a component, athree-dimensional model additionally including holes on the printedboard is required.

In addition, when creating the three-dimensional model of the wiringpattern, if each of the wired lines is modeled independently, the volumeof data of the three-dimensional model becomes so large that aprocessing speed of the mechanical-CAD decreases.

SUMMARY OF THE INVENTION

It is an object of the present invention to at least solve the problemsin the conventional technology.

An apparatus according to one aspect of the present invention is forcreating a three-dimensional model of a wiring pattern on a printedboard based on printed-board information created by an electricalcomputer-aided design, as a wiring model for a mechanical computer-aideddesign. The apparatus includes a three-dimensional-model creating unitthat creates the three-dimensional model including holes on the printedboard in addition to the wiring pattern, based on the printed-boardinformation.

An apparatus according to another aspect of the present invention is forcreating a three-dimensional model of a wiring pattern on a printedboard based on printed-board information created by an electricalcomputer-aided design, as a wiring model for a mechanical computer-aideddesign. The apparatus includes a three-dimensional-model creating unitthat creates the three-dimensional model by grouping wired lines in thewiring pattern for each path.

An apparatus according to still another aspect of the present inventionis for creating a three-dimensional model of a wiring pattern on aprinted board based on printed-board information created by anelectrical computer-aided design, as a wiring model for a mechanicalcomputer-aided design. The apparatus includes a three-dimensional-modelcreating unit that creates the three-dimensional model by excluding acutting-out area of a surface pattern in the wiring pattern.

An apparatus according to still another aspect of the present inventionis for creating a three-dimensional model of a wiring pattern on aprinted board based on printed-board information created by anelectrical computer-aided design, as a wiring model for a mechanicalcomputer-aided design. The apparatus includes a three-dimensional-modelcreating unit that creates the three-dimensional model by grouping pinsin the wiring pattern for each component.

An apparatus according to still another aspect of the present inventionis for creating a three-dimensional model of a wiring pattern on aprinted board based on printed-board information created by anelectrical computer-aided design, as a wiring model for a mechanicalcomputer-aided design. The apparatus includes a three-dimensional-modelcreating unit that creates the three-dimensional model by excludingconductors under a component and a surface pattern on the printed board.

An apparatus according to still another aspect of the present inventionis for creating a three-dimensional model of a wiring pattern on aprinted board based on printed-board information created by anelectrical computer-aided design, as a wiring model for a mechanicalcomputer-aided design. The apparatus includes a three-dimensional-modelcreating unit that creates, when a user specifies a virtual object thatdoes not exist on the printed board, a three-dimensional model of thevirtual object and includes created three-dimensional model of thevirtual object in the wiring model.

A method according to still another aspect of the present invention isfor creating a three-dimensional model of a wiring pattern on a printedboard based on printed-board information created by an electricalcomputer-aided design, as a wiring model for a mechanical computer-aideddesign. The method includes creating the three-dimensional modelincluding holes on the printed board in addition to the wiring pattern,based on the printed-board information.

A method according to still another aspect of the present invention isfor creating a three-dimensional model of a wiring pattern on a printedboard based on printed-board information created by an electricalcomputer-aided design, as a wiring model for a mechanical computer-aideddesign. The method includes creating the three-dimensional model bygrouping wired lines in the wiring pattern for each path.

A method according to still another aspect of the present invention isfor creating a three-dimensional model of a wiring pattern on a printedboard based on printed-board information created by an electricalcomputer-aided design, as a wiring model for a mechanical computer-aideddesign. The method includes creating the three-dimensional model byexcluding a cutting-out area of a surface pattern in the wiring pattern.

A method according to still another aspect of the present invention isfor creating a three-dimensional model of a wiring pattern on a printedboard based on printed-board information created by an electricalcomputer-aided design, as a wiring model for a mechanical computer-aideddesign. The method includes creating the three-dimensional model bygrouping pins in the wiring pattern for each component.

A method according to still another aspect of the present invention isfor creating a three-dimensional model of a wiring pattern on a printedboard based on printed-board information created by an electricalcomputer-aided design, as a wiring model for a mechanical computer-aideddesign. The method includes creating the three-dimensional model byexcluding conductors under a component and a surface pattern on theprinted board.

A computer-readable recording medium according to still another aspectof the present invention stores therein a computer program for creatinga three-dimensional model of a wiring pattern on a printed board basedon printed-board information created by an electrical computer-aideddesign, as a wiring model for a mechanical computer-aided design. Thecomputer program causes a computer to execute creating thethree-dimensional model including holes on the printed board in additionto the wiring pattern, based on the printed-board information.

A computer-readable recording medium according to still another aspectof the present invention stores therein a computer program for creatinga three-dimensional model of a wiring pattern on a printed board basedon printed-board information created by an electrical computer-aideddesign, as a wiring model for a mechanical computer-aided design. Thecomputer program causes a computer to execute creating thethree-dimensional model by grouping wired lines in the wiring patternfor each path.

A computer-readable recording medium according to still another aspectof the present invention stores therein a computer program for creatinga three-dimensional model of a wiring pattern on a printed board basedon printed-board information created by an electrical computer-aideddesign, as a wiring model for a mechanical computer-aided design. Thecomputer program causes a computer to execute creating thethree-dimensional model by excluding a cutting-out area of a surfacepattern in the wiring pattern.

A computer-readable recording medium according to still another aspectof the present invention stores therein a computer program for creatinga three-dimensional model of a wiring pattern on a printed board basedon printed-board information created by an electrical computer-aideddesign, as a wiring model for a mechanical computer-aided design. Thecomputer program causes a computer to execute creating thethree-dimensional model by grouping pins in the wiring pattern for eachcomponent.

A computer-readable recording medium according to still another aspectof the present invention stores therein a computer program for creatinga three-dimensional model of a wiring pattern on a printed board basedon printed-board information created by an electrical computer-aideddesign, as a wiring model for a mechanical computer-aided design. Thecomputer program causes a computer to execute creating thethree-dimensional model by excluding conductors under a component and asurface pattern on the printed board.

A method of manufacturing a device, according to still another aspect ofthe present invention, includes creating a three-dimensional model of awiring pattern on a printed board based on printed-board informationcreated by an electrical computer-aided design, as a wiring model for amechanical computer-aided design. The creating includes creating thethree-dimensional model including holes on the printed board in additionto the wiring pattern, based on the printed-board information.

The above and other objects, features, advantages and technical andindustrial significance of this invention will be better understood byreading the following detailed description of presently preferredembodiments of the invention, when considered in connection with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic of a system in which an electrical CAD and amechanical CAD interlock, according to an embodiment of the presentinvention;

FIG. 2 is a functional block diagram of a layout-model creatingapparatus;

FIG. 3 is a schematic for explaining coordinates transformation by athree-dimensional-model creating unit;

FIG. 4 is a schematic for explaining a process of a lower componentperformed by a component excluding unit and a process of a componentwith a non-insulated top surface performed by a top-surface processingunit;

FIG. 5 is a flowchart of a procedure performed by the layout-modelcreating apparatus;

FIG. 6 is a functional block diagram of a wiring-model creatingapparatus;

FIG. 7 is a schematic for explaining an example of a user screen forspecifying a hole-output property;

FIG. 8 is a schematic for explaining an example of a user screen forspecifying a conductor;

FIG. 9 is a schematic for explaining an example of a user screen forspecifying a virtual object;

FIG. 10 is a flowchart of a procedure performed by the wiring-modelcreating unit;

FIG. 11 is a flowchart of a procedure at pre-preparation shown in FIG.10; and

FIG. 12 is a functional block diagram of a computer that executes alayout-model creating program according to the present embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Exemplary embodiments of the present invention are described in detailbelow with reference to the accompanying drawings.

FIG. 1 is a schematic of a system in which an electrical CAD and amechanical CAD interlock, according to an embodiment of the presentinvention. As shown in FIG. 1, the system includes a mechanical CADdevice 10, an electrical CAD device 20, a layout-model creatingapparatus 100, and a wiring-model creating device 200.

The mechanical CAD device 10 aids in the mechanical designing bymanaging three-dimensional model data concerning, for example, a housingor a component of an information processing device. The electrical CADdevice 20 aids in the electrical designing by managing information on aprinted board or an electrical component.

The layout-model creating apparatus 100 is a device that aides theelectrical CAD and the mechanical CAD to interlock. The layout-modelcreating apparatus 100 creates a layout model from information in aprinted-board database created by the electrical CAD device 20, andoutputs the layout model in an intermediate data format (IDF). Thelayout model is a three-dimensional model of a printed board withelectrical components mounted thereon. The IDF is a file format that isused for exchanging information between the mechanical CAD and theelectrical CAD. Although the IDF is employed as the file format that isused for exchanging information between the mechanical CAD and theelectrical CAD, another file format can be employed.

The wiring-model creating device 200 is a device that aids theelectrical CAD and the mechanical CAD to interlock. The wiring-modelcreating device creates a wiring model from the information in theprinted-board database created by the electrical CAD device 20, andoutputs the wiring model in the IDF. The wiring model is athree-dimensional model of a wiring pattern and a hole of the printedboard.

The mechanical CAD device 10 integrates the layout model created by thelayout-model creating apparatus 100 and the wiring model created by thewiring-model creating device 200 to use the integrated model in themechanical designing. Details of the layout-model creating apparatus 100and the wiring-model creating device 200 are described below.

FIG. 2 is a functional block diagram of the layout-model creatingapparatus 100. As shown in FIG. 2, the layout-model creating apparatus100 includes a control unit 100 a that performs a process required tocreate the layout model and a storing unit 100 b that stores informationrequired to create the layout model therein.

The control unit 100 a includes a user-instruction reading unit 110, acomponent-information reading unit 120, a three-dimensional modelcreating unit 130, a component excluding unit 140, a top-surfaceprocessing unit 150, and a three-dimensional-model output unit 160. Thestoring unit 100 b stores therein user-instruction information 101, acomponent-installation-information list 102, acomponent-attribution-information list 103, acomponent-shape-information list 104, and three-dimensional-modelinformation 105.

The user-instruction reading unit 110 is a processing unit that, in aprocess of creating the layout model, reads a user instruction andwrites the instruction as the user-instruction information 101 to thestoring unit 100 b. The user instruction read by the user-instructionreading unit 110 includes layout information on the layout model(specifications with regard to coordinates transformation), thespecified height for excluding a lower component from the layout model(a component equal to or lower than the specified height is excludedfrom the layout model), a value to be added to a height of a componentwith a non-insulated top surface, a color in which the component withthe non-insulated top surface is painted, and an another color in whicha component with an undefined height is painted.

The component-information reading unit 120 is a processing unit thatreads the printed-board database created by the electrical CAD andwrites the printed-board database to the storing unit 100 b as thecomponent-installation-information list 102, thecomponent-attribution-information list 103, and thecomponent-shape-information list 104. Thecomponent-installation-information list 102 includes an X-coordinate, aY-coordinate, a surface, and an angle of each component, thecomponent-attribution-information list 103 includes an insulationproperty, a heat resistance, and a height of each component, and thecomponent-shape-information list 104 includes a shape of each component.

The three-dimensional-model creating unit 130 is a processing unit thatcreates a three-dimensional model of each component from thecomponent-installation-information list 102 and thecomponent-shape-information list 104 and writes the three-dimensionalmodel as the three-dimensional-model information to the storing unit 100b.

When creating the three-dimensional model, the three-dimensional-modelcreating unit 130 performs coordinates transformation based on thelayout information in the user-instruction information 101. FIG. 3 is aschematic for explaining the coordinates transformation performed by thethree-dimensional-model creating unit 130. As shown in FIG. 3, it ispossible for the user to specify parameters such as a moving amount inthe X-axis, a moving amount in the Y-axis, a rotating angle of theprinted board, and inversing a viewing direction as the layoutinformation. The three-dimensional-model creating unit 130 performs thecoordinates transformation based on the layout information specified bythe user to create the three-dimensional model.

Because the three-dimensional-model creating unit 130 performs thecoordinates transformation based on the layout information specified bythe user to create the three-dimensional model, it is possible to usethe three-dimensional model created by the electrical CAD in themechanical CAD without the coordinates transformation, which reduces anamount of user work.

The component excluding unit 140 is a processing unit that excluding acomponent equal to or lower than the specified height in theuser-instruction information 101 from the layout model. The componentexcluding unit 140 also paints the component with an undefined height inthe specified color by referring the color specification in theuser-instruction information 101. More specifically, the componentexcluding unit 140 outputs information such as a model name of thecomponent with an undefined height and the specified color in which thecomponent with an undefined height is painted to a color instructionfile. The color instruction file is read by the mechanical CAD device10. Because the component excluding unit 140 paints the component withan undefined height in the specified color, the component with anundefined height is highlighted.

The top-surface processing unit 150 is a processing unit that determineswhether a top surface of a component is insulated and when the topsurface is determined to be non-insulated adds the specified value to aheight of the component with the non-insulated top surface. Morespecifically, the top-surface processing unit 150 changes the height ofthe component with the non-insulated top surface by correcting thethree-dimensional-model information 105 in the storing unit 100 b.

The top-surface processing unit 150 paints the component with thenon-insulated top surface in the specified color by referring to thecolor specification in the user-instruction information 101. Morespecifically, the top-surface processing unit 150 outputs informationsuch as a model name of the component with the non-insulated top surfaceand the specified color in which the component with the non-insulatedtop surface is painted to the color instruction file.

FIG. 4 is a schematic for explaining a process of the lower componentperformed by the component excluding unit 140 and a process of thecomponent with the non-insulated top surface performed by thetop-surface processing unit 150. As shown in FIG. 4, because thecomponent excluding unit 140 excludes the component equal to or lowerthan the height specified by the user from the layout model, the volumeof the model of the printed board decreases and operability at themechanical CAD improved.

As shown in FIG. 4, because the top-surface processing unit 150 adds thevalue specified by the user to the component with the non-insulated topsurface, it is possible for the user to be free from cares about theinsulated property of the components during operating the mechanical CADand to easily verify the three-dimensional model with the mechanicalCAD. Also, because the top-surface processing unit 150 paints thenon-insulated top surface of the component in the color specified by theuser, it is possible for the user to easily distinguish thenon-insulated top-surface at the verification with mechanical CAD.

The three-dimensional-model output unit 160 is a processing unit thatoutputs the three-dimensional-model information 105 stored in thestoring unit 100 b in the IDF file.

The procedure performed by the layout-model creating apparatus 100 isdescribed below. FIG. 5 is a flowchart of the procedure performed by thelayout-model creating apparatus 100. As shown in FIG. 5, in thelayout-model creating apparatus 100, the user-instruction reading unit110 reads a user instruction to write the instruction to the storingunit 100 b as the user-instruction information 101 (step S101), and thecomponent-information reading unit 120 reads the component informationfrom the printed-board database to write the information to the storingunit 100 b as the component-installation-information list 102, thecomponent-attribution-information list 103, and thecomponent-shape-information list 104 (step S102).

The three-dimensional-model creating unit 130 selects one of thecomponents (step S103), performs the coordinates transformation based onthe layout information included in the user-instruction information 101,creates a three-dimensional model of the selected component while, andwrites the created three-dimensional model to the storing unit 100 b asthe three-dimensional-model information 105 (step S104).

The component excluding unit 140 determines whether the component has adefined height. When the height is undefined (the height is undefined atstep S105), the component excluding unit 140 paints the component in thespecified color by referring to the color specification in theuser-instruction information 101 (step S111). When the height is defined(defined at step S105), the component excluding unit 140 compares theheight of the component with the specified height. When the height ofthe component is equal to or lower than the specified height (equal toor lower than the specified height, at step S105), the component isexcluded from target objects to be modeled in three-dimensional and theprocess goes to step S110.

When the height of the component is higher than the specified height(higher than the specified height, at step S105), the component isincluded in the target objects. The top-surface processing unit 150determines whether a top surface of the component included in the targetobjects is insulated (step S106). When the top surface is non-insulated,the top-surface processing unit 150 adds the specified value in theuser-instruction information 101 (the user can set the specified valueto zero) to the height of the component with the non-insulated topsurface (step S107), and paints the top surface of the component in thespecified color (step S108). When the user does not specify the color inwhich the non-insulated top surface is painted, the top-surfaceprocessing unit 150 does not paint the non-insulated top surface.

The three-dimensional-model output unit 160 outputs thethree-dimensional-model information 105 in the IDF file (step S109), anddetermines whether all of the components is processed by thethree-dimensional-model creating unit 130 (step S110). When there is anunprocessed component, the process goes to step S103 to select a nextcomponent. When all components are processed, the process ends.

As described above, in the process of creating the layout model, thelayout-model creating apparatus 100 performs the coordinatestransformation, paints the specified color on the component with anundefined height, excludes the lower component, adds the specified valueto the height of the component with the non-insulated top surface, andpaints the component with the non-insulated top surface in the specifiedcolor, which makes the created layout model easy to be used with themechanical CAD.

FIG. 6 is a functional block diagram of the wiring-model creating device200. As shown in FIG. 6, the wiring-model creating device 200 includes acontrol unit 200 a that performs a process required to create the wiringmodel and a storing unit 200 b that stores information required tocreate the wiring model therein.

The control unit 200 a includes a user-instruction reading unit 210, aprinted-board-information reading unit 220, a hole processing unit 230,a conductor processing unit 240, a marking/resist processing unit 250, avirtual processing unit 260, and a three-dimensional-model output unit270.

The storing unit 200 b stores therein user-instruction information 201,a component-information list 202, board information 203, layerinformation 204, a conductor-information list 205, a hole-informationlist 206, a marking-information list 207, a resist-information list 208,and three-dimensional-model information 209.

The user-instruction reading unit 210 is a processing unit that, in theprocess of creating the wiring model, reads a user instruction andwrites the user instruction to the storing unit 200 b as theuser-instruction information 201. The user instruction read by theuser-instruction reading unit 210 includes instructions such asspecifying target objects to be modeled in three-dimensional from thecomponents in the printed board, merging wired lines and component pins,and suppressing an output of the cutting-out shapes in a surfacepattern.

The printed-board-information reading unit 220 is a processing unit thatreads the printed-board database created by the electrical CAD andwrites the printed-board database to the storing unit 200 b as thecomponent-information list 202, the board information 203, the layerinformation 204, the conductor-information list 205, thehole-information list 206, the marking-information list 207, and theresist-information list 208.

The component-information list 202 includes installation information ofeach component such as an X-coordinate, a Y-coordinate, a surface, andan angle and an X-coordinate and a Y-coordinate of each component pin.The board information 203 includes a thickness of each layer of theboard and an insulated layer. The layer information 204 includes anattribution of each layer. The conductor-information list 205 includesinformation on a wired line such as coordinates of a start point and anend point, a width and a layer to be placed, information on a surfacepattern such as coordinates of a vertex and a layer to be placed, andinformation on a text such as a height and a layer to be placed. Thehole-information list 206 includes in an X-coordinate, a Y-coordinate,and a drilled diameter of a hole. The marking-information list 207includes a figure or a text to be marked. The resist-information list208 includes a resist area and a resist-forbidden information.

The hole processing unit 230 is a processing unit that creates athree-dimensional model of a hole in a board land or for a componentterminal and writes information on the created three-dimensional modelto the storing unit 200 b as the three-dimensional-model information209. The hole to be created in three-dimensional is specified by theuser and stored in the storing unit 200 b as the user-instructioninformation 201. The hole processing unit 230 excludes a hole with adrilled diameter smaller than a diameter specified by the user from thetarget objects, which reduces a volume of the created three-dimensionalmodel.

FIG. 7 is a schematic for explaining an example of a user screen forspecifying a hole-output property. As shown in FIG. 7, it is possiblefor the user to specify the target objects from the board land, thecomponent terminal, a manual land, and a via. It is also possible forthe user to specify a drilled diameter of the hole to be created inthree-dimensional.

The conductor processing unit 240 is a processing unit that creates athree-dimensional model of a conductor such as a component terminal (apin), a wired line, a surface pattern, a land/via, or a text as a wiringpattern and writes information on the created three-dimensional model tothe storing unit 200 b as the three-dimensional-model information 209.The conductor to be created in three-dimensional is specified by theuser. FIG. 8 is a schematic for explaining an example of a user screenfor specifying the conductor to be created in three-dimensional. Asshown in FIG. 8, it is possible for the user to specify the conductor tobe created in three-dimensional from ones placed on a surface of theprinted board.

If each of the pins is created in three-dimensional, the volume of thecreated three-dimensional model can become large. To avoid theenlargement, it is possible for the user to direct the conductorprocessing unit 240 to create a single model of a plurality of pins foreach component. The user specifies the modeling of the pins by componentthrough the user screen shown in FIG. 8.

If each of the wired lines is created in three-dimensional, the volumeof the created three-dimensional model becomes large. To avoid theenlargement, it is possible for the user to specify merging of the wiredlines. Upon receiving the merging, the conductor processing unit 240traces the wired lines for each component pin and creates a single modelof the wired lines.

When creating a three-dimensional model of the surface pattern, if allcutting-out shapes in the surface pattern is modeled, the volume of thethree-dimensional model becomes large. Therefore, when a user issues aninstruction for suppressing an output of the cutting-out shapes, theconductor processing unit 240 performs a modeling as a model of an outerframe of the surface pattern alone. The user can specify whether tosuppress the output of the cutting-out shapes, through the user screenshown in FIG. 8.

When creating the user issues an instruction for excluding conductorsunder the components and the surface pattern from the target objects,the conductor processing unit 240 recognizes the conductors under thecomponents and the surface pattern not present. The user can specifywhether to output the conductor under the components and the surfacepattern, through the user screen shown in FIG. 8.

The marking/resist processing unit 250 is a processing unit that createa three-dimensional model of a marking/resist and writes information onthe created three-dimensional model to the storing unit 200 b as thethree-dimensional-model information 209.

The virtual processing unit 260 is a processing unit that creates athree-dimensional model of a virtual object that isn't present on theprinted board for an evaluation at the mechanical CAD, and that writesinformation on the created three-dimensional model to the storing unit200 b as the three-dimensional-model information 209. A virtual objectto be created in three-dimensional is specified by the user. FIG. 9 is aschematic for explaining an example of a user screen for specifying thevirtual object. As shown in FIG. 9, to specify the virtual object to becreated in three-dimensional, the user specifies a drawing at“conditions for outputting a user layer”. A component for preventing theprinted board from a vertical deviation and a cooling component areregarded as the virtual objects.

The three-dimensional-model output unit 270 is a processing unit thatoutputs the three-dimensional-model information 209 stored in thestoring unit 200 b in the IDF file. The three-dimensional-model outputunit 270 separately outputs the information on three-dimensional modelof holes including a model name, a position, and a diameter in ahole-instruction file. The hole-instruction file is read by themechanical CAD device 10.

FIG. 10 is a flowchart of the procedure performed by the wiring-modelcreating device 200. As shown in FIG. 10, in the wiring-model creatingdevice 200, the user-instruction reading unit 210 reads an userinstruction to write the user instruction to the storing unit 200 b asthe user-instruction information 201 (step S201), theprinted-board-information reading unit 220 reads information on theprinted board from the printed-board database to write the informationon the printed board to the storing unit 200 b as thecomponent-information list 202, the board information 203, the layerinformation 204, the conductor-information list 205, thehole-information list 206, the marking-information list 207, and theresist-information list 208 (step S202).

The conductor processing unit 240 performs pre-preparations such asmerging of the lines or merging of the component pins (step S203). Thehole processing unit 230 determines whether a drilled diameter of a holeis equal to or larger than the specified diameter (step S204). When thedilled diameter is equal to or larger than the specified diameter, thehole processing unit 230 creates a three-dimensional model of the holeand the three-dimensional-model output unit 270 outputs thethree-dimensional model created by the hole processing unit 230 in theIDF file (step S205). When the dilled diameter is smaller than thespecified diameter, the hole is excluded from the target objects and thethree-dimensional model of the hold is not created.

The conductor processing unit 240 creates a three-dimensional model ofeach conductor in the conductor-information list 205, i.e., theterminal, the wired line, the surface pattern, the land/via, and thetext), and the three-dimensional-model output unit 270 outputs thethree-dimensional model created by the conductor processing unit 240 inthe IDF file (steps from S206 to S210).

The marking/resist processing unit 250 creates a three-dimensional modelof the marking/resist, and the three-dimensional-model output unit 270outputs the three-dimensional model created by the marking/resistprocessing unit 250 in the IDF file (step S211).

The virtual processing unit 260 creates a three-dimensional model of avirtual object specified by the user, and the three-dimensional-modeloutput unit 270 outputs the three-dimensional model created by thevirtual processing unit 260 in an IDF file (step S212).

As described above, by creating the three-dimensional models of thehole, the conductor, the marking/resist, and the virtual object of theprinted board, the created wiring model becomes accurate.

FIG. 11 is a flowchart of the procedure at the pre-preparation shown inFIG. 10. As shown in FIG. 11, the conductor processing unit 240determines whether an instruction for merging the wired lines has beenissued by referring to the user-instruction information 201 (step S301).When the instruction for merging the wired lines has been issued, theconductor processing unit 240 groups the wired lines by path (stepS302), and changes the data in the conductor-information list 205.

The conductor processing unit 240 determines whether an instruction foran output of the cutting-out shapes in surface pattern has been issuedby referring to the user-instruction information 201 (step S303). Whenthe instruction for the output of the cutting-out shapes in the surfacepattern has been issued, the conductor processing unit 240 sets a flagthat temporarily causes the cutting-out shapes in the surface patternnot present (step S304). At step S208 shown in FIG. 10, the conductorprocessing unit 240 creates the three-dimensional model of the surfacepattern by referring to the flag set at the pre-preparation.

The conductor processing unit 240 determines whether an instruction formerging the component pins has been issued by referring to theuser-instruction information 201 (step S305). When the instruction formerging the component pins has been issued, the conductor processingunit 240 groups the component pins (step S306) and changes the data inthe conductor-information list 205.

Because the conductor processing unit 240 groups the wired lines and thecomponent pins and suppressing the output of the cutting-out shapes inthe surface pattern, the volume of the created three-dimensional modelbecomes lighten.

According to the embodiment, in the process in which the layout-modelcreating apparatus 100 creates the layout model from the componentinformation created by the electrical CAD, the three-dimensional-modelcreating unit 130 performs the coordinates transformation as the userhas specified, the component excluding unit 140 paints the componentwith an undefined height in the specified color and excludes thecomponent with a height lower than the height specified by the user fromthe target objects, and the top-surface processing unit 150 sets theheight of the component with the non-insulated top surface higher thanthe actual or paints the non-insulated top surface in the colorspecified by the user. As a result, it is possible to create the layoutmodel that is easy to be used with the mechanical CAD.

Furthermore, according to the embodiment, the wiring-model creatingdevice 200 creates the wiring model compatible with the mechanical CADfrom the information on the holes and the conductors on the printedboard created by the electrical CAD, which allows the user to performthe mechanical designing while checking the information on the wiring onthe printed board with the mechanical CAD.

Moreover, according to the embodiment, in the process of creating thewiring model by the wiring-model creating device 200, according to theuser instruction, the hole processing unit 230 excludes the hole withthe diameter smaller than the diameter specified by the user from thetarget objects, the conductor processing unit 240 groups the wired linesor the component pins to create the three-dimensional model of thegrouped wired lines or the grouped component pins, and the conductorprocessing unit 240 excludes the cutting-out shapes in the surfacepattern and the conductors under the components or the surface patternfrom the target objects, which makes it possible to reduce the volume ofthe three-dimensional model.

Furthermore, according to the embodiment, in the process of creating thewiring model by the wiring-model creating device 200, according to theuser instruction, the virtual processing unit 260 creates thethree-dimensional model of the virtual object that isn't present on theprinted board, which makes it possible to create the wiring modelincluding the three-dimensional model for aiding in the evaluation atmechanical CAD.

Although the layout-model creating apparatus 100 and the wiring-modelcreating device 200 are described in the embodiment, it is possible tocreate the layout-model creating program and the wiring-model creatingprogram with similar functions by implementing the configurations of thelayout-model creating apparatus 100 and the wiring-model creating device200 in software. A computer that executes the layout-model creatingprogram is described below. The wiring-model creating model can beexecuted by the similar computer.

FIG. 12 is a functional block diagram of a computer 300 that executesthe layout-model creating program according to the embodiment of thepresent invention. As shown in FIG. 12, the computer 300 includes arandom access memory (RAM) 310, a central processing unit (CPU) 320, ahard disk drive (HDD) 330, a local area network (LAN) interface 340, aninput/output interface 350, and a digital versatile disk (DVD) drive360.

The RAM 310 stores a program or an interval result of the programtherein. The CPU 320 reads the program from the RAM 310 to execute theread program. The HDD 330 stores a program or data therein. The LANinterface 340 is used for connecting the computer 300 to anothercomputer via a LAN. The input/output interface 350 is used forconnecting an input device, such as a mouse or a keyboard, or a displaydevice to the computer 300. The DVD drive 360 reads or writes from or toa DVD.

A layout-model creating program 311 executed by the computer 300 isstored in the DVD, and is read from the DVD by the DVD drive 360 to beinstalled on the computer 300. It is allowable that the layout-modelcreating program 311 is stored in a database in the other computerconnected to the computer 300 via the LAN interface 340, and is readfrom the database to be installed on the computer 300. The layout-modelcreating program 311 is stored in the HDD 330, and is loaded to the RAM310 to be executed by the CPU 320.

Although the layout-model creating apparatus 100 and the wiring-modelcreating device 200 are described as independent devices from themechanical CAD device 10 and the electrical CAD device 20 according tothe embodiment, the functions of the layout-model creating apparatus 100and the wiring-model creating device 200 can be included in themechanical CAD device 10 and the electrical CAD device 20. It is alsoallowable to employ an integrated device that aids the electrical CADand the mechanical CAD to interlock with the functions of both thelayout-model creating apparatus 100 and the wiring-model creating device200.

As described above, according to an embodiment of the present invention,because a designer notices the holes on the printed board when making adesign, it is possible to obtain an effect of improving quality in thedesigning.

Furthermore, according to an embodiment of the present invention,because the number of the holes is reduced, it is possible to obtain aneffect of lightening a volume of the wiring model.

Moreover, according to an embodiment of the present invention, becausethe number of the wired lines is reduced, it is possible to obtain aneffect of lightening a volume of the wiring model.

Furthermore, according to an embodiment of the present invention,because the surface pattern without the cutting-out shapes is modeled,it is possible to obtain an effect of lightening a volume of the wiringmodel.

Moreover, according to an embodiment of the present invention, becausethe number of the pins is reduced, it is possible to obtain an effect oflightening a volume of the wiring model.

Furthermore, according to an embodiment of the present invention,because the number of the conductors is reduced, it is possible toobtain an effect of lightening a volume of the wiring model.

Moreover, according to an embodiment of the present invention, because acomponent that had not been dealt with in the electrical-CAD can beprovisionally included in the three-dimensional model, it is possible toobtain an effect of facilitating the evaluation with the mechanical-CAD.

Although the invention has been described with respect to a specificembodiment for a complete and clear disclosure, the appended claims arenot to be thus limited but are to be construed as embodying allmodifications and alternative constructions that may occur to oneskilled in the art that fairly fall within the basic teaching herein setforth.

1. An apparatus for creating a three-dimensional model of a wiringpattern on a printed board based on printed-board information created byan electrical computer-aided design, as a wiring model for a mechanicalcomputer-aided design, the apparatus comprising: athree-dimensional-model creating unit that creates the three-dimensionalmodel including holes on the printed board in addition to the wiringpattern, based on the printed-board information.
 2. The apparatusaccording to claim 1, wherein the three-dimensional-model creating unitexcludes a hole with a diameter smaller than a predetermined value fromthe three-dimensional model.
 3. An apparatus for creating athree-dimensional model of a wiring pattern on a printed board based onprinted-board information created by an electrical computer-aideddesign, as a wiring model for a mechanical computer-aided design, theapparatus comprising: a three-dimensional-model creating unit thatcreates the three-dimensional model by grouping wired lines in thewiring pattern for each path.
 4. An apparatus for creating athree-dimensional model of a wiring pattern on a printed board based onprinted-board information created by an electrical computer-aideddesign, as a wiring model for a mechanical computer-aided design, theapparatus comprising: a three-dimensional-model creating unit thatcreates the three-dimensional model by excluding a cutting-out area of asurface pattern in the wiring pattern.
 5. An apparatus for creating athree-dimensional model of a wiring pattern on a printed board based onprinted-board information created by an electrical computer-aideddesign, as a wiring model for a mechanical computer-aided design, theapparatus comprising: a three-dimensional-model creating unit thatcreates the three-dimensional model by grouping pins in the wiringpattern for each component.
 6. An apparatus for creating athree-dimensional model of a wiring pattern on a printed board based onprinted-board information created by an electrical computer-aideddesign, as a wiring model for a mechanical computer-aided design, theapparatus comprising: a three-dimensional-model creating unit thatcreates the three-dimensional model by excluding conductors under acomponent and a surface pattern on the printed board.
 7. An apparatusfor creating a three-dimensional model of a wiring pattern on a printedboard based on printed-board information created by an electricalcomputer-aided design, as a wiring model for a mechanical computer-aideddesign, the apparatus comprising: a three-dimensional-model creatingunit that creates, when a user specifies a virtual object that does notexist on the printed board, a three-dimensional model of the virtualobject and includes created three-dimensional model of the virtualobject in the wiring model.
 8. A method of creating a three-dimensionalmodel of a wiring pattern on a printed board based on printed-boardinformation created by an electrical computer-aided design, as a wiringmodel for a mechanical computer-aided design, the method comprising:creating the three-dimensional model including holes on the printedboard in addition to the wiring pattern, based on the printed-boardinformation.
 9. The method according to claim 8, wherein the creatingincludes excluding a hole with a diameter smaller than a predeterminedvalue from the three-dimensional model.
 10. A method of creating athree-dimensional model of a wiring pattern on a printed board based onprinted-board information created by an electrical computer-aideddesign, as a wiring model for a mechanical computer-aided design, themethod comprising: creating the three-dimensional model by groupingwired lines in the wiring pattern for each path.
 11. A method ofcreating a three-dimensional model of a wiring pattern on a printedboard based on printed-board information created by an electricalcomputer-aided design, as a wiring model for a mechanical computer-aideddesign, the method comprising: creating the three-dimensional model byexcluding a cutting-out area of a surface pattern in the wiring pattern.12. A method of creating a three-dimensional model of a wiring patternon a printed board based on printed-board information created by anelectrical computer-aided design, as a wiring model for a mechanicalcomputer-aided design, the method comprising: creating thethree-dimensional model by grouping pins in the wiring pattern for eachcomponent.
 13. A method of creating a three-dimensional model of awiring pattern on a printed board based on printed-board informationcreated by an electrical computer-aided design, as a wiring model for amechanical computer-aided design, the method comprising: creating thethree-dimensional model by excluding conductors under a component and asurface pattern on the printed board.
 14. A computer-readable recordingmedium that stores therein a computer program for creating athree-dimensional model of a wiring pattern on a printed board based onprinted-board information created by an electrical computer-aideddesign, as a wiring model for a mechanical computer-aided design,wherein the computer program causes a computer to execute: creating thethree-dimensional model including holes on the printed board in additionto the wiring pattern, based on the printed-board information.
 15. Thecomputer-readable recording medium according to claim 14, wherein thecreating includes excluding a hole with a diameter smaller than apredetermined value from the three-dimensional model.
 16. Acomputer-readable recording medium that stores therein a computerprogram for creating a three-dimensional model of a wiring pattern on aprinted board based on printed-board information created by anelectrical computer-aided design, as a wiring model for a mechanicalcomputer-aided design, wherein the computer program causes a computer toexecute: creating the three-dimensional model by grouping wired lines inthe wiring pattern for each path.
 17. A computer-readable recordingmedium that stores therein a computer program for creating athree-dimensional model of a wiring pattern on a printed board based onprinted-board information created by an electrical computer-aideddesign, as a wiring model for a mechanical computer-aided design,wherein the computer program causes a computer to execute: creating thethree-dimensional model by excluding a cutting-out area of a surfacepattern in the wiring pattern.
 18. A computer-readable recording mediumthat stores therein a computer program for creating a three-dimensionalmodel of a wiring pattern on a printed board based on printed-boardinformation created by an electrical computer-aided design, as a wiringmodel for a mechanical computer-aided design, wherein the computerprogram causes a computer to execute: creating the three-dimensionalmodel by grouping pins in the wiring pattern for each component.
 19. Acomputer-readable recording medium that stores therein a computerprogram for creating a three-dimensional model of a wiring pattern on aprinted board based on printed-board information created by anelectrical computer-aided design, as a wiring model for a mechanicalcomputer-aided design, wherein the computer program causes a computer toexecute: creating the three-dimensional model by excluding conductorsunder a component and a surface pattern on the printed board.
 20. Amethod of manufacturing a device comprising: creating athree-dimensional model of a wiring pattern on a printed board based onprinted-board information created by an electrical computer-aideddesign, as a wiring model for a mechanical computer-aided design,wherein the creating includes creating the three-dimensional modelincluding holes on the printed board in addition to the wiring pattern,based on the printed-board information.